Micron Technology is investing $7 billion to build an advanced chip packaging facility in Singapore as the semiconductor giant expands its capacity to cater to booming demand for AI chips.

The US semiconductor company has commenced construction on a new high-bandwidth memory advanced packaging facility.

It's Singapore's first facility dealing with HBM, part of the AI chips that's powering companies like Nvidia and TSMC to new heights.

Artificial intelligence is once again leading the market. New Street Research has tech picks to start 2025. Pierre Ferragu’s four picks for 2025 are Micron, Infineon, Nvidia, and Taiwan Semiconductor Manufacturing,

Micron Technology, Inc. (NASDAQ:MU) broke ground on a new High-Bandwidth Memory (HBM) advanced packaging facility near the company’s current facilities in Singapore. It marks Singapore’s first HBM advanced packaging facility,

Since AI emerged as the world's next megatrend about two years ago, one product in particular has become the technology sector's holy grail.

Operations are scheduled to start in 2026 with the expansion of packaging capacity beginning in 2027. Read more at straitstimes.com.

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Key Takeaways Micron shares could remain in focus on Tuesday after leading a broad chip rally to start the week amid optimism that robust AI demand will continue to drive sector growth this year. The stock rallied from a key support area on the highest trading volume since mid-December,

Artificial intelligence technology has been a major driver of the bull market over the past couple of years. Technology firms, especially the

Mizuho analysts project a positive 2025 for chipmakers, supported by robust artificial intelligence (AI) demand, data center expansion, and advancements in networking and memory chips. This optimism persists

The main piece of news driving Micron stock higher was that Nvidia will be using Micron's high-bandwidth-memory (HBM) in its new GeForce RTX 50 Blackwell GPUs that undergird its new advanced AI platform.